After announcing its top-end chipset, MediaTek is gearing up for the debut of the Dimensions 8200: the next SoC should see the light soon, also seen the debut aboard an iQOO device. Now, a Chinese insider sheds light on the processor’s specs, revealing what appears to be a minor upgrade (at least at first glance).
MediaTek Dimensity 8200: Specification details are shown
This will be the first smartphone (or one of the first) to feature the next MediaTek SoC iQOO Neo 7 SE, although we don’t currently have a release date. For what concern Dimensions 8200Chinese insider DigitalChatStation has previewed the specifications of the chipset, which seems to offer a slight improvement over the current generation.
The Dimension 8100 consists of a 4 x octa-core CPU 2.85GHz Cortex-A78 + 4 x 2.0GHz Cortex-A55, one GPU Mali-G610 MC6 and support for LPDDR5 RAM memory. There is also a 5G dual SIM modem, as well as Wi-Fi 6E and Bluetooth 5.3.
But what will be the novelties of the next Dimension 8200? According to insiders, we find the same configuration with four Cortex-A78 cores and four Cortex-A55, but with some changes. That’s exactly what we should have done an A78 at 3.1GHz and three A78 at 3.0 GHz; the A55 cores will not change (all four at 2.0 GHz). Even the GPU should remain the same.
In short, MediaTek’s new chipset should be a simple upgrade (albeit with more power) than a brand new solution.
Finally the leaker reports that the next redmi and iQOO They will have the Dimensity 8200 on their side and make their debut a price range below €269 at the exchange rate (2000 yuan).
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